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XVision 300

The Ultimate New Fab Tool

  • Unique 4 nm ultra-high resolution FIB and electron optics enable unparalleled process monitoring and root cause defect identification
  • Simultaneous in-process FIB cross-sectioning and SEM imaging allows for highly precise and convenient end point detection during FIB milling and TEM sample preparation
  • Newly designed ion optics offers high beam currrent for double throughput and substantially increased productivity
  • FOUP wafer handling allows preparation of TEM samples while keeping the wafer in its clean environment, which delivers most convenient sample handling